Microelectromechanical systems
Due to the presence of a capable interdisciplinary research team and unique laboratory equipment, the Future Green Microsystems Company helps solve problems in various industries through research projects. The company has so far signed research contracts with Iran Khodro, MAPNA, Mobarakeh Steel, Golgohar Sirjan, Magfa, Jahan Steel, etc. The company also provides laboratory services and training workshops to students and researchers. Research projects that lead to the continuous production of a product will be given priority. The company’s services in this regard include:
-Mask manufacturing
-Sputtering and electrochemical coating
-Microfluidics
-Sacrificial layer and flotation: beam, diaphragm, floating mass manufacturing
Rasa Laboratory Facilities
Surface Profile Gauge
Services that can be provided with this device: Coating of gold, copper, nickel and chromium layers up to a height of 100 microns
Vacuum Desiccator
Services that can be provided with this device: Dimensional measurement, imaging of microstructures and mechanisms
Mask Writer and Non-Contact Projection Lithography
Services that can be provided with this device: Surface cleaning, ceramic removal, very high-speed removal with corrosive liquids
Vacuum Oven
Services that can be provided with this device: Removing gas from the structure during heating and drying
DC Magnetron Sputter
Services available with this device: Chrome, gold, titanium, copper and nickel coating up to one micron thick
Spin Coater
Services available with this device: Photoresist coating and polymer layers
3D Printer
Services available with this device: Printing of ABS, PLA, TPU filaments is possible
Rotary Evaporator
Services that can be provided with this device: Separation of materials with different boiling points, Separation and purification of materials
Ultrasonic bath
Services that can be provided with this device: Surface cleaning, increasing removal speed, homogenizing solutions and dispersing particles
Electroplating station
Services that can be provided with this device: Gold, copper, nickel and chrome layer deposition up to 100 microns in height
Optical Microscope (OM)
Services that can be provided with this device: Dimensional measurement, imaging of microstructures and mechanisms
Ultrasonic Etching
Services that can be provided with this device: Surface cleaning, ceramic removal, very high-speed removal with corrosive liquids
Wet Etching Station Table
Services that can be provided with this device: Wet removal of Si, SiO2, Si3N4, nickel, copper, gold and chromium
Digital Scale
Services that can be provided with this device: Accurate weighing of materials and solutions
Lithography
Machine specifications: Maximum wafer size 4 inches, maximum photoresist thickness 50 microns
Services available with this machine: Lithography of wafers up to 4 inches
